| 摘要 |
<P>PROBLEM TO BE SOLVED: To eliminate defects in a metal filled in a through hole. <P>SOLUTION: An injection angle of a plating liquid is changed or a posture of a printed board W is changed, at the time point on the way of depositing a metal q from the plating liquid to fill a through hole h with the metal q while injecting the plating liquid toward the printed board W or injecting air bubble. <P>COPYRIGHT: (C)2013,JPO&INPIT |
