| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition excellent in adhesiveness to an inorganic substrate. <P>SOLUTION: This curable resin composition includes: a multifunctional thiol compound (A) with 200-2,000 molecular weight; a multifunctional epoxy resin (B) with 200-50,000 molecular weight and 80-6,000 g/mol epoxy equivalent; a specific-structured thioether-containing alkoxysilane derivative (C); and an amine compound (D) with 90-700 molecular weight. The weight ratio ((A)/(B)) is 0.05-30. (C) of 0.5-50 pts.wt. and (D) of 0.01-50 pts.wt. are contained based on 100 pts.wt. (A+B). <P>COPYRIGHT: (C)2013,JPO&INPIT |
