| 摘要 |
There is provided a substrate cleaning method which optimizes the shape of a roll cleaning member and can efficiently clean a substrate surface with a high degree of cleaning and reduce the number of defects remaining on the substrate surface. The substrate cleaning method performs scrub cleaning of a surface of a substrate with a roll cleaning member, having a large number of nodules on the surface and extending linearly over approximately an entire length of a diameter of the substrate and which forms a cleaning area between it and the substrate surface, by bringing the nodules into contact with the substrate surface while rotating the roll cleaning member and the substrate each in one direction. During this scrub cleaning, the area of contact between the nodules and the substrate surface in the cleaning area is made smaller in a forward-direction cleaning area.
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