WIRE SAW APPARATUS

摘要

The present invention relates to a wire saw apparatus for cutting an ingot. The wire saw apparatus for cutting a downwardly moving ingot according to the present invention comprises: a plurality of bobbins which are spaced apart from each other and rotate; a wire wound on the plurality of bobbins to cut an ingot; an insulating basket arranged in the spacing between the plurality of bobbins and beneath the ingot; and guide plates coupled to both sides of the insulation basket such that the guide plate faces the bobbins. Thus, a wafer which is partially broken and falls during ingot cutting may be prevented from being recognized as a disconnection of the wire, and the wafer which is partially broken and fallen in the insulation basket may be easily recognized from the outside.