发明名称 MOUNTING STRUCTURE OF CIRCUIT BOARD OF MULTILAYER CERAMIC CAPACITOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a mounting structure of the circuit board of a multilayer ceramic capacitor. <P>SOLUTION: In the mounting structure of the circuit board of a multilayer ceramic capacitor, a dielectric layer having an internal electrode formed thereon is laminated, and external electrode terminals being connected in parallel with the internal electrode are formed at both ends. The internal electrode of the multilayer ceramic capacitor and the circuit board are placed in a horizontal state, and the external electrode terminals and the lands on the circuit board are bonded by a conductive material. The ratio of the bonding area A<SB POS="POST">SOLDER</SB>of the conductive material to the area A<SB POS="POST">MLCC</SB>of the external electrode terminal is set less than 1.4, and thereby an action effect capable of reducing vibration and noise significantly can be exhibited. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012248846(A) 申请公布日期 2012.12.13
申请号 JP20120119346 申请日期 2012.05.25
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 AHN YON-GYU;YI BYON-HWA;PARK MN-CHOL;PARK SAN-SOO;PARK DON-SEOK
分类号 H01G2/06;H01G4/12;H01G4/232;H01G4/30 主分类号 H01G2/06
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