| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film formation apparatus that suppresses unnecessary adhesion of powder to a removal means for directly preventing the adhesion of powder while preventing unnecessary adhesion of powder to points other than a film formation point by a direct removal method. <P>SOLUTION: A film formation apparatus AP includes a brush 21 for removing remaining fine particles not contributed to film formation on the surface of a base material 19. The brush 21 is in contact with the surface of the base material 19 in at least a part of an isolated film formation area that is not included in a present film formation area where aerosol is sprayed by a nozzle 15 and an adjacent film formation area adjacent to the present film formation area, among a plurality of unit film formation areas, and that is isolated from the present film formation area, and it removes remaining fine particles. <P>COPYRIGHT: (C)2013,JPO&INPIT |
