| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a mold resin from entering and adhering to an external terminal part in a power semiconductor device molded from a resin. <P>SOLUTION: In the power semiconductor device which includes a heat sink 5, an insulating layer 6 provided on a main surface of the heat sink, a plurality of wiring patterns 7 provided on a main surface of the insulating layer, a plurality of external terminals 2 and 3 provided so as to contact the plurality of wiring patterns, a connecting member 12 of thermoplastic resin for connecting the plurality of external terminals with one another, and a resin case body 1 of thermoplastic resin covering the insulating layer 6 and the wiring patterns 7, occurrence of cracks of the resin case body 1 due to an external force is prevented as well as enabling simplification of a manufacture process by causing rigidity of the thermoplastic resin composing the connecting member 12 to be higher than that of the thermoplastic resin composing the resin case body 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
