发明名称 SOLDERING PASTE FLUX AND SOLDERING PASTE
摘要 <P>PROBLEM TO BE SOLVED: To provide a soldering paste excellent in a storage stability and durability, wherein resin is hardened at a low temperature in a short time and excellent further in durability, and flux used for the same. <P>SOLUTION: The soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups per molecule, (C) carboxylic acid having a melting point of 80-170&deg;C, and (D) a cyanate ester having two or more cyanato groups per molecule. Further, the soldering paste includes the soldering paste flux and solder metal powder. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012245529(A) 申请公布日期 2012.12.13
申请号 JP20110117076 申请日期 2011.05.25
申请人 HARIMA CHEMICALS INC 发明人 HAMAGAWA AKIYOSHI;KUKIMOTO YOICHI;HASEGAWA HIROSHI;SAKURAI HITOSHI
分类号 B23K35/363;B23K35/26;C22C12/00 主分类号 B23K35/363
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