发明名称 SEMICONDUCTOR DEVICE INCLUDING DOUBLE GATE ELECTRODE STRUCTURE, AND MANUFACTURING METHOD FOR THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device including a double gate electrode structure, that can increase the on current while minimizing the generation of leakage current, and provide a manufacturing method for the semiconductor device. <P>SOLUTION: A semiconductor device includes: a gate electrode disposed on a substrate; a first impurity implantation region and a second impurity implantation region disposed on the substrate so that each is disposed adjacent to each end of the gate electrode; and a channel region disposed between the first impurity implantation region and the second impurity implantation region. The gate electrode includes a first sub-gate electrode adjacent to the first impurity implantation region and a second sub-gate electrode adjacent to the second impurity implantation region. The first sub-gate electrode and the second sub-gate electrode are disposed on the channel region. In this semiconductor device, one channel region is independently controlled by the two sub-gates, so that the generation of leakage current can be minimized. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012248841(A) 申请公布日期 2012.12.13
申请号 JP20120118686 申请日期 2012.05.24
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 KIM JI-YOUNG;OH YONG-CHUL;WOO DONG-SOO;CHUNG HYUN WOO;JIN GYO-YOUNG;CHOI SEONG-KWAN;HONG HYEONG-SUN;HWANG YOO-SANG
分类号 H01L21/336;H01L21/8242;H01L21/8244;H01L21/8246;H01L21/8247;H01L27/105;H01L27/108;H01L27/11;H01L27/115;H01L29/78;H01L29/788;H01L29/792 主分类号 H01L21/336
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