发明名称 |
SEMICONDUCTOR DEVICE INCLUDING DOUBLE GATE ELECTRODE STRUCTURE, AND MANUFACTURING METHOD FOR THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device including a double gate electrode structure, that can increase the on current while minimizing the generation of leakage current, and provide a manufacturing method for the semiconductor device. <P>SOLUTION: A semiconductor device includes: a gate electrode disposed on a substrate; a first impurity implantation region and a second impurity implantation region disposed on the substrate so that each is disposed adjacent to each end of the gate electrode; and a channel region disposed between the first impurity implantation region and the second impurity implantation region. The gate electrode includes a first sub-gate electrode adjacent to the first impurity implantation region and a second sub-gate electrode adjacent to the second impurity implantation region. The first sub-gate electrode and the second sub-gate electrode are disposed on the channel region. In this semiconductor device, one channel region is independently controlled by the two sub-gates, so that the generation of leakage current can be minimized. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012248841(A) |
申请公布日期 |
2012.12.13 |
申请号 |
JP20120118686 |
申请日期 |
2012.05.24 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
KIM JI-YOUNG;OH YONG-CHUL;WOO DONG-SOO;CHUNG HYUN WOO;JIN GYO-YOUNG;CHOI SEONG-KWAN;HONG HYEONG-SUN;HWANG YOO-SANG |
分类号 |
H01L21/336;H01L21/8242;H01L21/8244;H01L21/8246;H01L21/8247;H01L27/105;H01L27/108;H01L27/11;H01L27/115;H01L29/78;H01L29/788;H01L29/792 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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