摘要 |
<P>PROBLEM TO BE SOLVED: To provide a probe pin for a semiconductor inspection device, which is obtained by forming a conductive hard film on a surface of a conductive base material, in which the surface of the film is hard to wear off when the probe pin comes into contact with a metal terminal or solder and the probe pin has excellent durability. <P>SOLUTION: A probe pin for a semiconductor inspection device includes a conductive base material, and a tungsten-containing carbon film. The tungsten-containing carbon film has only one diffraction peak in a range of 37°≤2θ≤40° at an angel of 2θ observed in a range of 30°≤2θ≤50° at an angle of 2θ in an X-ray diffraction analysis at a 2θ-θ mode. A ratio of the number of atoms of tungsten to the total number of atoms of the tungsten and the carbon in the tungsten-containing carbon film is preferably 40.0 to 65.0 atom%. <P>COPYRIGHT: (C)2013,JPO&INPIT |