发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a semiconductor device with high yields where an element having a layer containing an organic compound is provided on a flexible substrate. <P>SOLUTION: A method of manufacturing the semiconductor device comprises: forming a separation layer on a substrate; forming an inorganic compound layer, a first conductive layer, and a layer containing an organic compound on the separation layer; forming a second conductive layer in contact with the layer containing the organic compound and the inorganic compound layer to form an element formation layer; bonding a first flexible substrate onto the second conductive layer; and separating the separation layer from the element formation layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012248869(A) |
申请公布日期 |
2012.12.13 |
申请号 |
JP20120166823 |
申请日期 |
2012.07.27 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
SUZUKI TSUNENORI;NOMURA RYOJI;YUGAWA MIKIO;OSAWA NOBUHARU;MORIWAKA YOSHIE;ASAMI YOSHINOBU;SATO TAKENAO |
分类号 |
H01L21/336;H01L27/105;H01L27/28;H01L29/786;H01L45/00;H01L49/00;H01L51/05;H01L51/50;H05B33/02;H05B33/08;H05B33/22 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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