| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical coupling device, just as designed, by eliminating undesired swelling or irregularities on the surface of a translucent resin thereby suppressing variation of the optical characteristics. <P>SOLUTION: A recess 7 for light-emitting chip and a recess 8 for light-receiving chip that expose a part of a lead frame 2 are provided in a light-shielding resin body 1, and translucent resins 11, 12 for sealing a light-emitting chip 3 and a light-receiving chip 4 are injected into the recess 7 for light-emitting chip and the recess 8 for light-receiving chip. The surface of the translucent resins 11, 12 is located below the aperture side end of the sidewall surface of the recess 7 for light-emitting chip and the recess 8 for light-receiving chip, and has an at least partially flat surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
