| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pin-like fin integrated-type heat sink which is excellent in heat dissipation and is capable of supporting a ceramic substrate without causing it to crack. <P>SOLUTION: A pin-like fin integrated-type heat sink 1 is configured such that a planar upper surface 21 on which an electronic component having a ceramic substrate is mounted is formed on one surface side of a plate-like part 2 made of a metal material, and a lower surface 22 on which a number of pin-like fins 3 stand is formed on a surface opposite to the upper surface 21. The lower surface 22 includes: a mounting part 7 located in a peripheral portion of the lower surface 22; a central portion 5 which is so formed that its thickness gradually increases from an inner edge of the mounting part 7 toward the center; and the number of pin-like fins 3 which stand on the central portion 5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
