| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting element capable of suppressing peeling of an insulating film. <P>SOLUTION: A manufacturing method of a light-emitting element comprises: a first step of forming an optical semiconductor layer 3 having an n-type layer 3a, a light-emitting layer 3b, and a p-type layer 3c on a substrate 2; a second step of forming a first electrode 4 in an exposed region Sp on the n-type layer; a third step of forming a second electrode 5 by sequentially laminating a first metal layer 5a which reflects the light emitted in the light-emitting layer and a second metal layer 5b covering the first metal layer and containing gold on the p-type layer; a fourth step of forming an adhesion layer 6 containing at least one of titanium and silicon on the second electrode; a fifth step of oxidizing a surface of the adhesion layer by heating the adhesion layer in an oxygen atmosphere; a sixth step of forming an insulating film 7 containing the silicon so as to coat the adhesion layer whose surface was oxidized, the second electrode, the p-type layer, and the light-emitting layer; and a seventh step of exposing a part of the second electrode by etching an insulating film and adhesion layer located in a portion of a region overlapping the second electrode. <P>COPYRIGHT: (C)2013,JPO&INPIT |
