| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve UPH by resolving restrictions that reduce UPH in a system comprising a cascade-type die bonder. <P>SOLUTION: There is provided an apparatus 200 which supplies substrates 206a, 206b; 500a, 500b, 500c with a semiconductor component 212 during manufacturing of a semiconductor-mounted component. The apparatus 200 comprises a platform 216, and a plurality of supply modules 202a, 202b attached to the platform 216. Each of the plurality of supply modules 202a, 202b includes: support devices 204a, 204b for supporting the substrates 206a, 206b; 500a, 500b, 500c, and supply devices 208a, 208b for supplying the substrates 206a, 206b; 500a, 500b, 500c with the semiconductor component 212. The support devices 204a, 204b are flush with each other, such that the substrates 206a, 206b; 500a, 500b, 500c are transported between the plurality of supply modules 202a, 202b. <P>COPYRIGHT: (C)2013,JPO&INPIT |
