| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring substrate in which defects such as seams and voids are unlikely to occur, and a manufacturing method thereof. <P>SOLUTION: A wiring substrate comprises: a substrate main body; a groove which opens to one surface side of the substrate main body, and of which a peripheral edge portion of an inner bottom surface and one end portion of an inner surface are connected through an inclined surface inclined with respect to the inner bottom surface and widening toward an end thereof; a through hole having one end in communication with the inner bottom surface and the other end opening to the other surface side of the substrate main body; a first conductive layer which fills at least a part of the through hole from the other end side; a second conductive layer which covers a surface of the first conductive layer on a groove side and extends at least over a part of the inside of the groove except the inner surface; and a third conductive layer which covers the second conductive layer and fills the groove. <P>COPYRIGHT: (C)2013,JPO&INPIT |
