| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can correct characteristics of the semiconductor device with reducing an influence on chip size. <P>SOLUTION: A semiconductor device manufacturing method comprises: forming a semiconductor circuit 2 in a chip region of a semiconductor wafer; forming a semiconductor circuit 1 for measurement having characteristics corresponding to characteristics of the semiconductor circuit 2 in a scribe region of the semiconductor wafer; and measuring characteristics of the semiconductor circuit 1 for measurement to correct the semiconductor circuit 2 formed in the chip region based on the measurement result by the semiconductor circuit 1 for measurement. <P>COPYRIGHT: (C)2013,JPO&INPIT |
