发明名称 METHOD FOR INSPECTING WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for inspecting a wiring board, which can reduce erroneous determination and missing of authenticity of failure when detection results of defective places of an automatic image inspection device include many misreports of contents of the detection results dependent on the shape and arrangement of a wiring pattern, and which is efficient. <P>SOLUTION: In a method for inspecting a wiring board, external appearance of each of many wiring board regions for a panel for the wiring board is inspected by an automatic image inspection device to detect all of defective places, the panel for the wiring board being formed by integrally arraying and forming many wiring board regions, each having the same wiring pattern, in a matrix shape, and thereafter a person looks at the images of the detected defective places to perform confirmation of authenticity of failure at the defective places. The defective places whose occurrence position in respective wiring boards is identical among the defective places detected by the automatic image inspection device are grouped for each occurrence position, and the confirmation is successively performed for each group regarding the grouped defective places. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012248597(A) 申请公布日期 2012.12.13
申请号 JP20110117704 申请日期 2011.05.26
申请人 KYOCER SLC TECHNOLOGIES CORP 发明人 NAKAYAMA MASASHI
分类号 H05K3/00;H05K1/02 主分类号 H05K3/00
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