| 发明名称 |
MODULE INCLUDING A SINTERED JOINT BONDING A SEMICONDUCTOR CHIP TO A COPPER SURFACE |
| 摘要 |
A module includes a substrate including a first copper surface and a semiconductor chip. The module includes a first sintered joint bonding the semiconductor chip directly to the first copper surface.
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| 申请公布号 |
US2012312864(A1) |
申请公布日期 |
2012.12.13 |
| 申请号 |
US201213591607 |
申请日期 |
2012.08.22 |
| 申请人 |
GUTH KARSTEN;NIKITIN IVAN;INFINEON TECHNOLOGIES AG |
发明人 |
GUTH KARSTEN;NIKITIN IVAN |
| 分类号 |
B23K31/02 |
主分类号 |
B23K31/02 |
| 代理机构 |
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代理人 |
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