发明名称 Printed Circuit Board and Method of Manufacturing the Same
摘要 Disclosed herein is a printed circuit board including: an insulating layer including a stopper layer for trench formation disposed in an inner portion thereof and trenches formed to expose the stopper layer for trench formation; and circuit patterns formed in the trenches.
申请公布号 US2012312591(A1) 申请公布日期 2012.12.13
申请号 US201113217589 申请日期 2011.08.25
申请人 HWANG SUN UK;WATANABE RYOICHI;MUN KYUNG DON;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 HWANG SUN UK;WATANABE RYOICHI;MUN KYUNG DON
分类号 H05K1/11;H05K1/00;H05K3/00 主分类号 H05K1/11
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