发明名称 |
BONDING MATERIAL AND BONDED OBJECT PRODUCED USING SAME |
摘要 |
Bonding materials which contain silver nanoparticles considerably change in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. The present invention provides a bonding material which contains silver nanoparticles and which meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface. The bonding material comprises silver nanoparticles which have an average primary-particle diameter of 1-200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier constituted of an organic substance. The bonding material has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa/s or lower and a thixotropic ratio ((viscosity measured at a shear rate of 3.1 [1/s])/(viscosity measured at a shear rate of 15.7 [1/s])) of 4 or lower. |
申请公布号 |
WO2012169076(A1) |
申请公布日期 |
2012.12.13 |
申请号 |
WO2011JP63421 |
申请日期 |
2011.06.10 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD.;KURITA SATORU;HINOTSU TAKASHI;SASAKI SHINYA |
发明人 |
KURITA SATORU;HINOTSU TAKASHI;SASAKI SHINYA |
分类号 |
B22F9/00;B22F1/00;B22F1/02;H01B1/00;H01B1/22;H01L21/52;H05K3/32 |
主分类号 |
B22F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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