发明名称 BONDING MATERIAL AND BONDED OBJECT PRODUCED USING SAME
摘要 Bonding materials which contain silver nanoparticles considerably change in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. The present invention provides a bonding material which contains silver nanoparticles and which meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface. The bonding material comprises silver nanoparticles which have an average primary-particle diameter of 1-200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier constituted of an organic substance. The bonding material has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa/s or lower and a thixotropic ratio ((viscosity measured at a shear rate of 3.1 [1/s])/(viscosity measured at a shear rate of 15.7 [1/s])) of 4 or lower.
申请公布号 WO2012169076(A1) 申请公布日期 2012.12.13
申请号 WO2011JP63421 申请日期 2011.06.10
申请人 DOWA ELECTRONICS MATERIALS CO., LTD.;KURITA SATORU;HINOTSU TAKASHI;SASAKI SHINYA 发明人 KURITA SATORU;HINOTSU TAKASHI;SASAKI SHINYA
分类号 B22F9/00;B22F1/00;B22F1/02;H01B1/00;H01B1/22;H01L21/52;H05K3/32 主分类号 B22F9/00
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