| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an arrangement plan making device such that a cutoff length of a material is small even in the latter half of a lot and the number of orders arranged from one material is leveled. <P>SOLUTION: The arrangement plan making device for successively searching arrangements (saw-cut pattern) from leading materials (1) calculates a plurality of arrangement candidates (saw-cut pattern) for a plurality of unarranged materials from the leading materials, and adds them to the plurality of materials to make new arrangement plans (saw-cut pattern calculation part). Then the device (2) calculates an evaluated value of each new arrangement plan from an evaluation function (arrangement plan evaluation part), and (3) selects a set number of arrangement plans in order of decreasing evaluated value and deletes others (arrangement plan selection part). The processes (1) to (3) are repeated until an arrangement plan making completion condition is met, and a plurality of arrangement plans are searched for one lot. Lastly, the device (4) determines a plan having the highest evaluated value as an arrangement plan for the log out of the plurality of arrangement plans (arrangement plan determination part). <P>COPYRIGHT: (C)2013,JPO&INPIT |
