| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mold device capable of uniformly cooling the surface of a mold. <P>SOLUTION: This mold device includes: a cavity mold 100 including a cavity mold plate 110 formed with a cavity 120 on the front face 110a, and including heating means 111 in the inside, and cooling plates 130 contacting/separating to/from the back face 110b of the cavity mold plate 110, and including cooling means 131 in the inside; and a core mold 200 defining the cavity 120 together with the cavity mold plate 110; wherein two or more of the cooling plates 130 are provided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
