| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress the generation of a reactant due to the atmosphere in a hermetically sealed container. <P>SOLUTION: A semiconductor manufacturing device 1 comprises: a wafer 10 that is a work piece; a front opening unified pod (FOUP) 20 that is a hermetically sealed container and houses the wafer 10; and an equipment front end module (EFEM) 40 transferring the wafer 10 between an etching apparatus 30 serving as a semiconductor processing device and the FOUP 20 in a sealing state. The FOUP 20 has a front surface door 20a, a sensor part 21 that detects at least one of the temperature, the humidity, and the gas concentration, and a transmission device 25 that transmits information detected by the sensor part, at the inside thereof. A reception device 31 receives the information from the transmission device 25 and supplies the information to a purge part 43. The purge part 43 conducts purging until the temperature in the FOUP 20 or the like satisfies a predetermined reference value. <P>COPYRIGHT: (C)2013,JPO&INPIT |
