| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a die bonder or a bonding method capable of picking up a die from a prealignment stage reliably in a short time. <P>SOLUTION: A die is picked up from a wafer and mounted on a prealignment stage, a suction nozzle provided in a bonding head picks up the die from the prealignment stage, the mounting state of the die on the prealignment stage is imaged, and a determination is made as to whether or not a plurality of dies, out of more than one die mounted on the prealignment stage, can be sucked collectively based on the imaging results, and then the die is sucked and picked up based on the determination results before being bonded to a circuit board. <P>COPYRIGHT: (C)2013,JPO&INPIT |
