| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor laser device preventing the problem in which leakage light of a laser and radiation heat from a heating element are remained in a package to increase a temperature in the package, resulting in deterioration of reliability and quality. <P>SOLUTION: A semiconductor laser device includes a laser and radiation heat absorbing layer 18 in a package 5. This structure can prevent temperature increase in the package 5, ensure reliability and quality of the device, and accommodate a semiconductor laser element 1 having higher output. <P>COPYRIGHT: (C)2013,JPO&INPIT |
