| 摘要 |
PURPOSE: A lead type gap supporter and method thereof are provided to automate the installation of the gap supporter by installing gap supporter through soldering on PCB substrate; through lead formed in the body. CONSTITUTION: A gap supporter(30) has a bulk type body(31) that is comprised with insulator such as epoxy or plastic. Leads(32a,32b) are extended to both sides of body. Lead has an upward bend portion formed on an appointed area buried under the body. The lead is adhered to the PCB substrate through soldering. The lead is installed in order to fix the body on the PCB substrate. In order to have the body center and be faced, the lead is extended to both sides through the lower end of the side of the body. The lead is extended to both sides of body through the bottom plane of body. |
