Wiring substrate and method for manufacturing the wiring substrate

摘要

A wiring substrate (10) includes an insulation layer including a thermosetting resin (13) and a reinforcement member (12) having plural first fiber bundles (12a) and plural second fiber bundles (12b) woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings (15,16) arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.