| 摘要 |
<p>The method involves positioning a power electronic component (2) on a heat sink (1) at a location, where the component is to be fixed. A hole (9) is punched in the heat sink from a heat sink surface opposite to a surface to which the component is applied, using a punch (7) whose diameter is less than that of the hole. The hole is punched such that the punch bores the heat sink and crosses the hole by taking a material of the heat sink to flare and to fold against an edge of the hole opposite to the heat sink so as to crimp an assembly of the heat sink and the component, mechanically. An independent claim is also included for a machine for assembling a heat sink and a power electronic component.</p> |
