发明名称 |
SEMICONDUCTOR DEVICE WITH A VARIABLE INTEGRATED CIRCUIT CHIP BUMP PITCH |
摘要 |
<p>A semiconductor device is described that comprises an integrated circuit substrate comprising a plurality of bonding pads for enabling electrical connectivity to a chip circuit. The bonding pads are at least partially covered by a passivation layer having pre-manufactured holes. The device also includes a chip having a plurality of bumps atop the bonding pads, wherein areas of the bumps are larger than respective areas of cooperating holes in the passivation layer.</p> |
申请公布号 |
EP2532027(A2) |
申请公布日期 |
2012.12.12 |
申请号 |
EP20110703283 |
申请日期 |
2011.02.02 |
申请人 |
POLYMER VISION B.V. |
发明人 |
VAN LIESHOUT, PETRUS JOHANNES GERARDUS |
分类号 |
H01L23/485;G02F1/1333;G06F1/16;H01L21/60 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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