TWO-PART THERMOCURABLE POLYIMIDE RESIN COMPOSITION AND CURED PRODUCT THEREOF

摘要

It relates to a highly heat resistant thermosetting polyimide resin composition that is cured at a temperature of 150°C or less, and provides a cured product that generates a less amount of decomposed gas even under heating to 250°C, and has flexibility and adhesiveness. A two-component thermosetting polyimide resin composition containing a liquid A containing a polyimide (a) having a main chain constituted by a repeating unit having a polyoxyalkylenediamine structure with amino groups on both ends thereof, and a liquid B containing a bismaleimide compound, and a cured product of a thermosetting polyimide resin composition obtained by mixing these two liquids and curing the mixture under heating.