| 摘要 |
<p>The invention relates to a mounting device of electronic components which not only corresponding to shape and size of adsorbed and mounnted electronic components, but also corresponding to weight of electronic components, proceesing selection of adsorption unit such as adsorption mouth and setting of mounting action. A weight support spring 5 counteracts weight of freely up-down moved adsorption part. A load sensor 7 measures the applied pressure. A pressure spring 6 applies a pressure corresponding to amount of movement of the absorption part to the load sensor. Therefore, a part is constructed for detecting weight of electronic parts 1 absorbed on the absorption mounth 2, then detecting weight of electronic parts 1 absorbed on the absorption mounth 2 on the base of the applied pressure measured by the load sensor 7.</p> |
