APPARATUS AND METHOD FOR FORMING AN ENCAPSULATION OF LIGHT EMITTING DEVICE

摘要

PURPOSE: A device and method for forming an encapsulant of a light emitting device are provided to reduce interfacial delamination between the encapsulant and a substrate by separately forming each encapsulant corresponded to multiple light emitting devices on one substrate. CONSTITUTION: An upper mold(20) includes a substrate. The substrate mounts a plurality of optical semiconductors. A lower mold(30) faces the upper mold. A resin space(40) has resin between the upper mold and the lower mold. An ejector pin(52) divides an encapsulant formed on the substrate into several parts.