Manufacturing method for a sliding contact assembly

摘要

Manufacturing method for a sliding contact assembly (10) for low current applications, comprising the following steps:
- providing a printed circuit board substrate (16) with at least one stationary contact pad (18),
- providing a movable contact element (12) including a support member (26) having a contact surface (28) to be biased against said contact pad (18),
- plating at least one layer of gold on the contact pad (18),
characterized in that said plating step is implemented according to an Electroless Nickel Electroless Palladium Immersion Gold process step made by sequential deposition of:
- an electroless nickel layer (22),
- an electroless palladium layer (24),
- a gold flash layer (25).