METHOD AND APPARATUS FOR MONITORING A POLISHING SURFACE OF A POLISHING PAD USED IN POLISHING APPARATUS

摘要

PURPOSE: A monitoring method of the polished side of a polishing pad for a polishing device and an apparatus for the same are provided to ensure the flatness of the polished side of the polishing pad. CONSTITUTION: A monitoring method of the polished side of a polishing pad for a polishing device includes the following steps: the polished side(22a) of a polishing pad is conditioned by swaying a rotary dresser; the height of the polished side is measured; the position of the height measuring point is calculated on a secondary plane which is defined on the polished side; the distribution of heights in the polished side is generated by repeating the measurement and the calculation; the abnormal height distribution of the polished side is generated; and the conditioning of the polished pad is evaluated.