| 摘要 |
PURPOSE: An etching processing apparatus is provided to prevent damage to a wafer due to a pace error by including a wafer jig unit to mount the edge of the wafer. CONSTITUTION: A crucible(100) receives a wafer. A wafer jig unit(200) includes a groove to mount the wafer. The wafer jig unit includes a plurality of grooves. The edge of the wafer is mounted in the groove. A support(210) supports the wafer.
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