| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board, having high strength against tensile stress in the thickness direction or shearing stress in a direction of intersecting the thickness direction perpendicularly and exhibiting higher reliability as compared with prior art, and to provide its manufacturing method. SOLUTION: A recess is formed in a copper foil on one side of a prepreg 31, and a solder layer 35 is formed on this recess. A land 36 is formed, by patterning the copper foil, and then a through-hole 31a is formed by irradiating laser from the other side of the prepreg 31. Subsequently, a recess 36a is formed by etching the backside of the land 36, and a contact via 37 is formed by filling the through-hole 31a with paste. Thereafter, a PET film 33 stuck to the other side of the prepreg 31 is removed, and a plurality of prepregs 31 are laminated, while sandwiching an adhesive film 38 and integrated by being hot pressed, thus producing a multilayer wiring board 30. The solder layer 35 is integrated with the contact via 37, and a rivet profile having opposite ends swollen is obtained. COPYRIGHT: (C)2007,JPO&INPIT |
