| 摘要 |
PROBLEM TO BE SOLVED: To arrange a reinforcing member on front and rear surfaces of a wiring member with superior manufacturing efficiency, and to effectively prevent deformation at the time of applying an external force, related to a wiring board and its manufacturing method including a process removing the supporting body after forming the wiring member by laminating a wiring layer and an insulating layer on a supporting body. SOLUTION: This method includes: a process for laminating wiring layers 18, 18a-18c, 19 and 19a-19c and insulating layers 20, 20a and 20b over a copper foil 12 to form the wiring member 30; a process for removing the copper foil 12 from the wiring member 30; and a process for arranging a first reinforcing member 50 on the front surface of the wiring member 30 with the use of a first adhesive member 36, and further arranging a second reinforcing member 52 on the rear surface of the wiring member 30 with the use of a second adhesive member 37. COPYRIGHT: (C)2009,JPO&INPIT |
