发明名称 |
Thermal and power bus stacked package architecture |
摘要 |
A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board.
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申请公布号 |
US8331094(B2) |
申请公布日期 |
2012.12.11 |
申请号 |
US201113012078 |
申请日期 |
2011.01.24 |
申请人 |
ANKIREDDI SESHASAYEE;GEKTIN VADIM;ORACLE INTERNATIONAL CORPORATION |
发明人 |
ANKIREDDI SESHASAYEE;GEKTIN VADIM |
分类号 |
H05K7/20;F28F7/00;H01L23/48 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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