发明名称 Method and system for providing contact to a first polysilicon layer in a flash memory device
摘要 A method and system for providing at least one contact in a flash memory device is disclosed. The flash memory device includes a plurality of gate stacks and at lease one component including a polysilicon layer as a top surface. The method and system further include forming a silicide on the top surface of the polysilicon layer and providing an insulating layer covering the plurality of gate stacks, the at least one component and the silicide. The method and system also include etching the insulating layer to provide at least one contact hole. The insulating layer etching step uses the silicide as an etch stop layer to ensure that the insulating etching step does not etch through the polysilicon layer. The method and system also include filling the at least one contact hole with a conductor.
申请公布号 US8329530(B1) 申请公布日期 2012.12.11
申请号 US201213566741 申请日期 2012.08.03
申请人 CHANG MARK S.;FANG HAO;KO KING WAI KELWIN;SPANSION LLC 发明人 CHANG MARK S.;FANG HAO;KO KING WAI KELWIN
分类号 H01L31/0328;H01L21/8247;H01L27/115;H01L31/0336;H01L31/072;H01L31/109 主分类号 H01L31/0328
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