发明名称 Wired circuit board and producing method thereof
摘要 A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board, an insulating base layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the insulating base layer and a having a terminal portion. An opening is formed in the insulating base layer to expose the metal foil.
申请公布号 US8327535(B2) 申请公布日期 2012.12.11
申请号 US201113317108 申请日期 2011.10.11
申请人 OOYABU YASUNARI;ISHII JUN;NISHI KENSUKE;NITTO DENKO CORPORATION 发明人 OOYABU YASUNARI;ISHII JUN;NISHI KENSUKE
分类号 H05K3/10 主分类号 H05K3/10
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