发明名称 |
Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating |
摘要 |
An apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
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申请公布号 |
US8329006(B2) |
申请公布日期 |
2012.12.11 |
申请号 |
US20090431030 |
申请日期 |
2009.04.28 |
申请人 |
GEBHART LAWRENCE E.;SUN JENNY J.;MILLER PHILLIP O.;TAYLOR E. JENNINGS;FARADAY TECHNOLOGY, INC. |
发明人 |
GEBHART LAWRENCE E.;SUN JENNY J.;MILLER PHILLIP O.;TAYLOR E. JENNINGS |
分类号 |
C25D17/00;C25D5/00;C25D5/08;C25D21/10;H05K3/24 |
主分类号 |
C25D17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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