| 摘要 |
A method for producing a joined structure, containing: after placing an anisotropic conductive film in the predetermined manner, placing a wiring member containing a wiring plate formed thereon, where the wiring plate has a resist region in which the wiring plate is covered with a resist layer, and a second electrode region in which the wiring plate is not covered with the resist layer, so that the edge of the resist region at a boundary with the second electrode region comes above the chamfer part of the substrate; and heating and compressing the anisotropic conductive film from the side of the wiring member to melt and make the anisotropic conductive film flow into the side of the resist region to thereby cover the second electrode region with the anisotropic conductive film, so as to electrically connect the first electrode region and the second electrode region. |
