发明名称 Printed circuit board
摘要 A first insulating layer is formed on a suspension body and a wiring trace is formed on the first insulating layer. In addition, a ground trace is formed on the first insulating layer so as to extend along the wiring trace on one side of the wiring trace with a spacing therebetween. A second insulating layer is formed on the first insulating layer to cover the wiring trace and the ground trace. On the second insulating layer, a wiring trace is formed at a position above the wiring trace. A third insulating layer is formed on the second insulating layer to cover the wiring trace. The width of the wiring trace is set larger than the width of the wiring trace. At least a partial region of the ground trace and at least a partial region of the wiring trace are opposite to each other with part of the second insulating layer sandwiched therebetween.
申请公布号 US8330047(B2) 申请公布日期 2012.12.11
申请号 US20090409544 申请日期 2009.03.24
申请人 HO VOONYEE;KAMEI KATSUTOSHI;NITTO DENKO CORPORATION 发明人 HO VOONYEE;KAMEI KATSUTOSHI
分类号 H05K1/00 主分类号 H05K1/00
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