| 摘要 |
PURPOSE: A printed circuit board and a method for manufacturing the same are provided to reduce the stress delivered in bonding a chip and substrate and to improve the reliability of the chip. CONSTITUTION: A pad(120) is formed on an insulating layer. A protective layer(130) is formed on the insulating layer. The protective layer comprises an opening part exposing the surface of a pad. A bump(160) is formed on the exposed pad through the opening part of the protective layer. The bump is protruded in the surface of the protective layer.
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