| 摘要 |
The semiconductor device includes an n-channel transistor including n-type source/drain regions and a first gate electrode, a first sidewall insulating film formed on a side wall of the first gate electrode and having a Young's modulus smaller than a Young's modulus of silicon, a p-channel transistor including p-type source/drain regions and a second gate electrode, a second sidewall insulating film formed on a side wall of the second gate electrode and having a Young's modulus larger than the Young's modulus of silicon, a tensile stressor film formed, covering the n-channel transistor, and a compressive stressor film formed, covering the p-channel transistor. |
