| 摘要 |
<p>PURPOSE: A light emitting device package and a manufacturing method thereof are provided to improve heat dissipation characteristics since the light emitting device package reduces a route which comes in contact with a circuit board. CONSTITUTION: A light emitting device is arranged in a first body. Second bodies(200a,200b) face the first body between the light emitting devices and one side of the second body is combined with the first body. A molding unit covers the light emitting device between the first body and the second body. The molding unit is separated from the second body at a predetermined distance.</p> |
