| 摘要 |
<p>PURPOSE: A light emitting diode is provided to prevent a short circuit according to an electrical contact by forming an electrical insulating layer of an LED chip around a lateral side of metal conductive plugs. CONSTITUTION: A substrate comprises a body(43), a plurality of third pads, a fourth pad(24), a first electrode(25), a second electrode, a plurality of first vias(21), and a second via(22). The body comprises a first surface and a second surface which faces the first surface. The first electrode and the second electrode are arranged on the second surface of the body. The first vias electrically connect one of the third pads with the first electrode by passing through across the body. The second via electrically connects the fourth pad with the second electrode by passing through across the body. [Reference numerals] (11) Substrate; (14) N-pad; (15) P-pad; (AA) Bonding process of silicon and a flip chip; (BB) Bonding process of the flip chip and a silicon substrate; (CC) Bonding</p> |
