摘要 |
PURPOSE: A molding block, an apparatus for molding an electric component, and a molding method for the electrical device are provided to reduce process time for fixing electronic components on an upper mold by simultaneously fixing the electronic components. CONSTITUTION: A lower mold(110) has a base and a cavity portion. An upper portion(130) is arranged to face the lower mold. A holder(150) is arranged in a peripheral portion of the base. The holder is elastically connected to the lower mold. The holder is arranged to receive a carrier in a state of supporting the lower side of an electronic component.
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