发明名称 MOLDING BLOCK AND APPARATUS FOR MOLDING AN ELECTRIC DEVICE AND METHOD OF MOLDING AN ELECTRICAL DEVICE
摘要 PURPOSE: A molding block, an apparatus for molding an electric component, and a molding method for the electrical device are provided to reduce process time for fixing electronic components on an upper mold by simultaneously fixing the electronic components. CONSTITUTION: A lower mold(110) has a base and a cavity portion. An upper portion(130) is arranged to face the lower mold. A holder(150) is arranged in a peripheral portion of the base. The holder is elastically connected to the lower mold. The holder is arranged to receive a carrier in a state of supporting the lower side of an electronic component.
申请公布号 KR101209527(B1) 申请公布日期 2012.12.11
申请号 KR20110108386 申请日期 2011.10.21
申请人 TEKWELL SYSTEM CO., LTD. 发明人 KIM, HYUN HEE
分类号 H01L21/56 主分类号 H01L21/56
代理机构 代理人
主权项
地址