| 摘要 |
<p>The disclosed adhesive sheet (1) for manufacturing a semiconductor device is provided with: a base film (10); an adhesive layer (20) disposed on top of the base film (10); an adhesive layer (30) that is disposed on top of the first adhesive layer (20) and has an opening (30a) through which the first adhesive layer (20) is exposed; and a die-bonding film (40) disposed on the section (25) of the first adhesive film (20) that is exposed through the aforementioned opening (30a). At least part of the outer edge of the die-bonding film (40) is in contact with the second adhesive layer (30).</p> |
